Impact of Different Type of Nanofluids on the Combined System Performance From Cold Plate and Heat Sink

  • Mohammed Yaseen Lafta, Thamer Khalif Salem, Raaid Rashad Jassem Al Doury
Keywords: Finned cold plat, electronic cooling system, Nanofluid cooling technology, Heat transfer, nanofluid (Al2O3 - water), nanofluid (CuO - water).

Abstract

    Modern electronics, heat exchangers, and other devices in which there is significant heat generation that affects their performance require cost-effective and efficient heat transfer and dissipation technologies. Nanofluid cooling technology is applied on a finned cold plat. The system was analyzed mathematically by using the EES program. The cold plate is made of 6061 aluminum alloy with dimensions (109, 109, 25) mm, containing five tracks with a diameter of 9 mm, length of (335.2) mm, and eleven fins of a height 50 mm and a length of 93 mm. The temperature range of inlet and outlet fluid was (50-80) oc. The applied speeds were within the range (0.1 - 1.3 1 m/s). The results were compared at the working fluid (water, nanofluid (Al2O3 - water), and nanofluid (CuO - water).  The results show that applying nanofluid enhance the overall efficiency of the CPHS. This improvement decreases as the flowrate increase. Moreover, it proportional to the thermal conductivity of the nanoparticle’s material. It is clear that when (φ) is (0.0025%), the overall efficiency of the system is approximately equal to (74.82% and 74.85%) for (Al2O3 - water and CuO - water), respectively. when phi equals 0.005, the pumping power values ​​are (0.030718 W) and are approximately equal for both nanofluids (Al2O3 and CuO), but for nanoparticle volume fractions (0.03) the value of PP is (0.030862 W). and 0.030936 Watts) for (CuO and Al2O3), respectively. 

Published
2021-10-05
How to Cite
Raaid Rashad Jassem Al Doury, M. Y. L. T. K. S. (2021). Impact of Different Type of Nanofluids on the Combined System Performance From Cold Plate and Heat Sink. Design Engineering, 1936-1957. Retrieved from http://thedesignengineering.com/index.php/DE/article/view/5095
Section
Articles