Experimental Investigation on Electrochemical Buffing

  • Vinod Rajput, Rahul Singh, Kartikeya Parmar
Keywords: Electrochemical Buffing, Concentration, Flow rate, Inter-electrode gap, LPH, current density, Electrolyte, Passive Film, surface Roughness, Abrasives

Abstract

Electrochemical buffing (ECB) is dual-action surface finishing technology that combines the metal removal process by electrochemical process (work piece itself is eroded, adding metal ions to the solution) and mechanical polishing with an abrasive. The ECB process finds applications in friction reduction in moving parts in vacuum, reducing residual stresses and out gassing. This report states that how the surface finish and material removal rate (MRR) are effected by parameters: concentration of electrolyte, inter-electrode gap (IEG), rotational speed of the tool and electrolytic flow rate. The result of experiment shows that the range of IEG should be within 100µm - 150µm,  electrolyte flow rate should be within 15LPH to 25PLH,  buff-head speed should be within the range of 300, 600 and 900 rpm is favorable. Present inter-electrode gap should be within 100µm - 150µm.

Published
2021-09-07
How to Cite
Kartikeya Parmar, V. R. R. S. (2021). Experimental Investigation on Electrochemical Buffing. Design Engineering, 11158-11173. Retrieved from http://thedesignengineering.com/index.php/DE/article/view/4118
Section
Articles